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Single-Event Upset and Scaling Trends in New Generation of the Commercial SOI PowerPC Microprocessors

机译:新一代商用SOI PowerPC微处理器的单事件翻转和扩展趋势

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摘要

SEU from heavy-ions is measured for SOI PowerPC microprocessors. Results for 0.13 micron PowerPC with 1.1V core voltages increases over 1.3V versions. This suggests that improvement in SEU for scaled devices may be reversed. In recent years there has been interest in the possible use of unhardened commercial microprocessors in space because of their superior performance compared to hardened processors. However, unhardened devices are susceptible to upset from radiation space. More information is needed on how they respond to radiation before they can be used in space. Only a limited number of advanced microprocessors have been subjected to radiation tests, which are designed with lower clock frequencies and higher internal core voltage voltages than recent devices [1-6]. However the trend for commercial Silicon-on-insulator (SOI) microprocessors is to reduce feature size and internal core voltage and increase the clock frequency. Commercial microprocessors with the PowerPC architecture are now available that use partially depleted SOI processes with feature size of 90 nm and internal core voltage as low as 1.0 V and clock frequency in the GHz range. Previously, we reported SEU measurements for SOI commercial PowerPCs with feature size of 0.18 and 0.13 m [7, 8]. The results showed an order of magnitude reduction in saturated cross section compared to CMOS bulk counterparts. This paper examines SEUs in advanced commercial SOI microprocessors, focusing on SEU sensitivity of D-Cache and hangs with feature size and internal core voltage. Results are presented for the Motorola SOI processor with feature sizes of 0.13 microns and internal core voltages of 1.3 and 1.1 V. These results are compared with results for the Motorola SOI processors with feature size of 0.18 microns and internal core voltage of 1.6 and 1.3 V.
机译:对于SOI PowerPC微处理器,测量了重离子的SEU。核心电压为1.1V的0.13微米PowerPC的结果超过了1.3V版本。这表明缩放设备的SEU改善可能会逆转。近年来,人们对未硬化的商用微处理器在太空中的使用产生了兴趣,因为它们与硬化处理器相比性能优越。但是,未硬化的设备容易受到辐射空间的干扰。在太空中使用它们之前,需要有关它们如何对辐射作出反应的更多信息。仅有限数量的高级微处理器经过了辐射测试,这些辐射设计的时钟频率和内部内核电压比最近的设备低[1-6]。但是,商用绝缘体上硅(SOI)微处理器的趋势是减小特征尺寸和内部内核电压并增加时钟频率。现在,具有PowerPC架构的商用微处理器可以使用部分耗尽的SOI工艺,其特征尺寸为90 nm,内部核心电压低至1.0 V,时钟频率在GHz范围内。以前,我们报告了特征尺寸为0.18和0.13 m的SOI商用PowerPC的SEU测量结果[7,8]。结果表明,与CMOS本体相比,饱和横截面减小了一个数量级。本文研究了高级商用SOI微处理器中的SEU,重点关注D-Cache的SEU灵敏度,并与功能尺寸和内部核心电压挂在一起。呈现了特征尺寸为0.13微米,内部核心电压为1.3和1.1 V的Motorola SOI处理器的结果。这些结果与特征尺寸为0.18微米,内部核心电压为1.6和1.3 V的Motorola SOI处理器的结果进行了比较。 。

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